DESCRIPTION : MA SERIES Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid circuits and automatic surface mounting on any printed circuit boards.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.
| Configuration | Nickel-Barrier Terminations |
RESISTANCE TO SOLDERING Termination Material | Code | Test Conditions | Nickel-barrier, Solder plated | N | 260oC, 60 Sn / 40 Pb solder, 10 secs. |
TOLERANCES AVAILABLE Dielectric | Available Tolerance | Capacitance | EIA | IEC | COG | 1BCG | ±0.25 pF
±0.5 pF
±1%,±2%,±5%, ±10%, | £5 pF
5 pF < CAP. < 10 pF
³10 pF | X7R | 2R1 | ±5%, ±10%, ±20% | All values | Z5U | 2E6 | ±20%, +80% -20%
| All values | Y5V | 2F4 | ±20%, +80% -20%
| All values |
Other tolerances are available upon request
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